Epoxy Stamping Reservoir: Setting range 0.1 mm - 5 mm (0.004' - 0.Dispenser Types: Pressure/time, Volumetric (Auger-screw type), High-performance D-style pump, Jetter.Heated bond head (optional) up to 350 ☌.Ideal solution with smallest footprint possible.Production line tailored 100% to your needs.Open Platform Architecture for Full Customization Hot and cold processes supported: epoxy, soldering, thermo-compression.Different substrates with highest reliability from standard FR process -4 laminates for exotic polyimide and PTFE based rigid and flexible materials. Die place to carrier, boat, substrate, PCB, lead frame, wafer 0 Comments You agree that when you pay paid service before expiry of notice period to complete, for all costs up to date of cancellation may be responsible mind.Die pick from wafer, waffle pack, gel pack, feeder.Epoxy writing & stamping and flux dipping capabilities.Die Attach, Flip Chip, Multi-Chip in one machine. ![]() Single pass production for complex products.High productivity, low cost-of-ownership.High Performance with unbeatable accuracy ![]() The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for. Datacon 2200 evo goes PLUS! VISION ALIGNMENT INTEGRATED DISPENSER PICK & PLACE HEAD FOIL MOLDING Future Proof Equipment Datacon 2200 evo Innovative Solution for Innovative Products The Datacon 2200 evo s enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
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